Qianli BGA Reballing Stencil Template for iPhone 14 13 12 11 Pro Max XS XR X 8 7 6S 6 CPU IC Chip Tin Soldering Net

Qianli BGA Reballing Stencil Template for iPhone 14 13 12 11 Pro Max XS XR X 8 7 6S 6 CPU IC Chip Tin Soldering Net

Reviewed byUpdated 14 Jun 2026

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Ideal tool for professional technicians engaged in electronic repairs, component replacements, and motherboard upgrades involving complex BGA rework tasks. Made of high-quality tin material, this stencil ensures reliable solder adhesion during chip reflow processes without causing damage to sensitive components. Precision-engineered template specifically designed for reballing CPU IC chips of various iPhones including 14 Pro Max, 13, 12, 11, XS, XR, X, 8, 7, 6S, 6 Plus models. Durable construction allows repeated usage without deformation or wear, ensuring long service life even under frequent heating and cooling cycles. Ensures precise alignment of ball grid array (BGA) components onto PCBs, reducing assembly time while improving efficiency and yield rates..syi

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