Gold plating process 4G5GsmartcardNONASIM contact smart card adapter card multi frequency compatibility

Using 24K gold plating process to create contact points, the thickness of the gold layer is over 0.15 μ m, and the conductivity is 30% higher than that of ordinary copper contacts, which can effectively reduce contact resistance The gold plating layer has extremely strong antioxidant and sulfide resistance, and even in humid and dusty environments, there will be no problems of contact oxidation, blackening, or poor contact The contact points are laser engraved for positioning, with an error controlled within 0.02mm, and are precisely attached to the smart card chip. When inserting or removing, the chip surface will not be scratched, avoiding card damage or data loss caused by alignment deviation